Uniform heat distribution,
suitable for high thermal conductivity needs

Resistance to temperature change with
a coefficient of thermal expansion
similar to that of Si

Excellent corrosion resistance to
reduce particles generated during processing

Circuit design technology considering temperature uniformity characteristics

Brazing bonding technology

Can be used in various temperature ranges (can be designed according to the application from low temperature to high temperature range)

Securing excellent durability and securing high reliability

Securing precision circuit printing technology

Securing heat treatment element technology

Core parts for semiconductor photo equipment

Leading technology for thin film heater development (with development capability)

Electroless plating technology: Cu, Ni, Au electroless plating technology